Electro-Plating: Surface coating of High Temperature Superconductors with Cu and Cu alloys*

Object: Finishing the HTS materials (contacting, joining, surface sealing) for the dedicated functionality 20 micrometer Cu are deposited by the galvanic process on the surface. Copper possess a unique central position within all the new HTS.

Coated Conductor (CC) tape with Cu shunt

2nd generation coated conductor

New Reel - to - reel  pulse  electroplating facility

Reel - to - reel Cu pulse - electroplating facility

ATZ developed, designed and fabricated a new larger pulse electroplating facility for continuous coated conductor (CC) Cu deposition*. The system will be rady and delivered in autumn 2010 / spring 2011.

Features, advantages

  • shunt function
  • Improved conductor current and voltage stability
  • Mechanical stabilization
  • Easy joint and contact fabrication
  • Solder ability
  • Better thermal coupling
  • Multi – layer function
  • Conductor surface masking

* Patents:

EP 1313895

DE 199 64 478.0-45, 13902814 (Appl.)